Iqhele ukusetyenziswa SMD MOSFET package pinout ngokulandelelana iinkcukacha

Yintoni indima yeeMOSFET?

Ii-MOSFETs zidlala indima ekulawuleni amandla ombane ayo yonke inkqubo yobonelelo lwamandla. Okwangoku, akukho MOSFET ezininzi ezisetyenziswa ebhodini, ngokuqhelekileyo malunga ne-10. Isizathu esiphambili kukuba uninzi lwee-MOSFETs zihlanganiswe kwi-IC chip. Ekubeni indima ephambili ye-MOSFET kukubonelela nge-voltage ezinzileyo yezixhobo, ngoko isetyenziswa ngokubanzi kwi-CPU, i-GPU kunye ne-socket, njl.Ii-MOSFETsangaphezulu nangaphantsi kohlobo lweqela lababini avela ebhodini.

Iphakheji ye-MOSFET

I-chip ye-MOSFET kwimveliso igqityiwe, kufuneka udibanise igobolondo kwi-chip ye-MOSFET, oko kukuthi, iphakheji ye-MOSFET. Iqokobhe le-chip ye-MOSFET linenkxaso, ukhuseleko, isiphumo sokupholisa, kodwa kunye ne-chip ukunika uqhagamshelo lombane kunye nokwahlukaniswa, ukuze isixhobo se-MOSFET kunye namanye amacandelo enze isekethe epheleleyo.

Ngokuhambelana nofakelo kwi-PCB indlela yokwahlula,I-MOSFETIphakheji ineendidi ezimbini eziphambili: NgeHole kunye neMount Mount. ifakelwe isikhonkwane se-MOSFET ngokusebenzisa imingxuma yokunyuka ye-PCB edityaniswe kwi-PCB. Umphezulu weMount sisikhonkwane se-MOSFET kunye neflange yokucima ubushushu edityaniswe kwiipadi zomphezulu zePCB.

IiNgcaciso zePakethe eziMgangatho KUYA kwiPakeji

I-TO (i-Transistor Out-line) yinkcazo yephakheji yokuqala, efana ne-TO-92, TO-92L, TO-220, TO-252, njl. ziyi-plug-in iphakheji yoyilo. Kwiminyaka yakutshanje, imfuno yentengiso yonyuswa phezulu, kwaye iipakethe ze-TO ziye zaqhubela phambili ukuya kwiipakethi zokunyuka komphezulu.

I-TO-252 kunye ne-TO263 ziiphakheji zokunyuka komphezulu. I-TO-252 ikwabizwa ngokuba yi-D-PAK kwaye i-TO-263 ikwabizwa ngokuba yi-D2PAK.

Iphakheji ye-D-PAK I-MOSFET inee-electrode ezintathu, isango (G), i-drain (D), umthombo (S). Enye ye-drain (D) isikhonkwane inqunyulwe ngaphandle kokusebenzisa umva we-sink yokufudumala kwi-drain (D), idityaniswe ngokuthe ngqo kwi-PCB, kwelinye icala, ukwenzela imveliso yangoku ephezulu, kwelinye icala, ngokusebenzisa PCB ukutshatyalaliswa kobushushu. Ke kukho iipads ezintathu zePCB D-PAK, idrain (D) pad inkulu.

Iphakheji TO-252 pin idayagram

Iphakheji ye-Chip ethandwayo okanye i-double in-line package, ebizwa ngokuba yi-DIP (iPhakheji ye-ln-line) .Ipakethe ye-DIP ngelo xesha ine-PCB efanelekileyo (ibhodi yesekethe eprintiweyo) yofakelo lwe-perforated, lula kune-TO-uhlobo lwephakheji ye-PCB yocingo kunye nokusebenza. ilunge ngakumbi kwaye njalo ezinye iimpawu zesakhiwo sepakethe yayo ngohlobo lwenani leefom, kubandakanywa ulwaleko oluninzi lwe-ceramic oluphindwe kabini kumgca we-DIP, umaleko omnye weCeramic Dual In-Line.

DIP, isakhelo sokukhokela i-DIP njalo njalo. Ngokuqhelekileyo isetyenziswa kwii-transistors zamandla, i-voltage regulator chip package.

ItshiphuI-MOSFETIphakheji

Iphakheji yeSOT

I-SOT (i-Small Out-Line Transistor) yiphakheji encinci ye-transistor. Le phakheji yiphakheji encinci ye-SMD yamandla e-transistor, encinci kune-TO package, esetyenziswa ngokubanzi kumandla amancinane e-MOSFET.

Iphakheji ye-SOP

I-SOP (iPhakheji encinci yokuPhuma) ithetha "iPhakheji yeNcane eNcinci" ngesiTshayina, i-SOP yenye yeepakethi zokunyuka komhlaba, izikhonkwane ezivela kumacala amabini epakethe ngendlela yephiko le-gull (L-shaped), izinto eziphathekayo. iplastiki kunye ne-ceramic. I-SOP ikwabizwa ngokuba yi-SOL kunye ne-DFP. Imigangatho yephakheji ye-SOP ibandakanya i-SOP-8, i-SOP-16, i-SOP-20, i-SOP-28, njl. Inombolo emva kwe-SOP ibonisa inani lezikhonkwane.

Iphakheji ye-SOP ye-MOSFET yamkela ubukhulu becala i-SOP-8, ishishini lithanda ukushiya i-"P", ebizwa ngokuba yi-SO (eNcinci i-Out-Line).

Iphakheji ye-SMD MOSFET

Iphakheji yeplastiki ye-SO-8, akukho siseko sepleyiti ye-thermal, ukuchithwa kobushushu okungalunganga, okuqhelekileyo kusetyenziselwa i-MOSFET yamandla aphantsi.

I-SO-8 yaqala ukuphuhliswa ngu-PHILIP, kwaye ngokuthe ngcembe ithathwe kwi-TSOP (iphakheji encinci ye-outline), i-VSOP (iphakheji encinci ye-outline), i-SSO (eyancitshiswayo ye-SOP), i-TSSOP (i-SOP encinci iyancipha) kunye nezinye iinkcukacha ezisemgangathweni.

Phakathi kwezi nkcukacha zephakheji zifunyenwe, i-TSOP kunye ne-TSSOP ziqhele ukusetyenziswa kwiiphakheji ze-MOSFET.

Chip MOSFET Packages

I-QFN (i-Quad Flat Non-leaded package) yenye yeepakethe eziphezu komhlaba, i-Chinese ebizwa ngokuba yi-flat-side non-leaded flat package, isayizi yephedi incinci, incinci, iplastiki njengesixhobo sokutywina se-chip ye-mountain ephumayo. Itekhnoloji yokupakisha, ngoku eyaziwa ngokuba yiLCC. Ngoku ibizwa ngokuba yi-LCC, kwaye i-QFN ligama elichazwe yi-Japan Electrical and Mechanical Industries Association. Iphakheji iqwalaselwe kunye nabafowunelwa be-electrode kumacala onke.

Iphakheji iqwalaselwe ngabafowunelwa be-electrode kuwo onke macala amane, kwaye ekubeni kungekho zikhokelo, indawo yokunyuka incinci kune-QFP kwaye ukuphakama kungaphantsi kwe-QFP. Le phakheji ikwabizwa ngokuba yiLCC, PCLC, P-LCC, njl.